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 Kinetics of formation of diffusion layer at the electrolytic deposition of aluminium on copper base from molten electrolyte

P. Fellner and M. Chrenková-Paučírová

Institute of Inorganic Chemistry, Slovak Academy of Sciences, 842 36 Bratislava

 

Abstract: Formation of diffusion layers in the system Cu-Al was investigated in the temp. range 200-400°. Temp. dependence of kinetics of formation of the diffusion layer can be formally described by interdiffusion coeff. D = 0.17 exp (-15,600 K/T). When the layer of alloy at the Cu-Al interphase is thinner than ca.3 μm, then its growth is faster than it corresponds to a process governed by diffusion.

Full paper in Portable Document Format: 363a321.pdf

 

Chemical Papers 36 (3) 321–325 (1982)

Monday, June 24, 2024

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